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Evaluation of interfacial bond strengths between amalgam and composite inlay.

PURPOSE: To evaluate the interfacial bond strengths between two amalgam alloys and an inlay resin composite bonded with two different luting agents. MATERIALS AND METHODS: Inlay composites ( EOS) were bonded with two different bonding systems (Geristore, All-Bond 2) to high- or low-copper amalgams (Valiant, Agestan). All tested specimens were thermocycled (100 cycles), tested for tensile bond strength and compared by ANOVA (P < 0.05). RESULTS: Bond strengths varied from 5.3 to 11.4 MPa, with Geristore bonded to high-copper amalgam providing the highest strength.[1]

References

  1. Evaluation of interfacial bond strengths between amalgam and composite inlay. Abdel-Aziz, A.H., Alhadainy, H.A. American journal of dentistry. (1998) [Pubmed]
 
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